JCL-PCB

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Contact Info

6th Floor, Building 4, Jindi Kaixuan Square, No. 31 Longcheng Avenue, Longgang Street, Longgang District,Shenzhen City,Guangdong Province
13554750839
13554750839@163.com
Week Days: 09.00 to 19.00 Sunday: Closed

Advanced PCB Capabilities

Process Specifications	Manufacturing Capabilities	Process Technology Overview
Layer Capabilities	1-30 Layer	Mass Production:1-16 layers Prototype Service: 1-30 layers
Impedance-controlled	2-16 Layers	With impedance tuning capability, Pricing subject to design complexity evaluation
PCB Material Specification	Base Material:FR-4	Double-Sided Layers: Kingboard A-Grade Laminate,Multilayer Construction: Shengyi High-Performance Prepreg.
Tg Grade Specification	Range: 130°C to 180°C	ConventionalTg:135'C,Medium Tg: 150°C, High Tg: 170°C.
Maximum Dimensions	53x60cm	Panelization Max Size:54.5x62.2cm Design Limits:*Single/Double-layer: 53x60cm·Multilayer: 52.5x59cm Boards exceeding these dimensions are considered oversized Final feasibility subject to design evaluation
Board Thickness Specifications	0.2-6.0mm	Thickness adiustable via lamination structure Special materials require custom procurement
Thickness Tolerance	Standard:+0.1mm or+10% (whichever is stricter)	For finished boards: ·≤1.0mm thickness: Strictly controlled to above tolerance ·>1.0mm thickness:Same tolerance applies
Drilling Specifications	0.1-6.25MM	Laser drilling required for holes ≤0.15mm Routing process required for holes >6.25mm
Hole Tolerance Specifications	0.05-0.1mm	PTH(Plated Through Hole):Diameter tolerance:+0.075mm NPTH (Non-Plated Through Hole):Diameter tolerance: +0.05mm Slot Holes (≥6.25mm):Dimensional tolerance:+0.1mm Hole Position Tolerance:Maximum deviation:+0.05mm
Aspect Ratio Specifications	12:01	Through Holes(PTH):Prototype:12:1 Mass production: 10:1 Blind Vias:1-step laser vias: 1.1 2+ step laser vias: 0.8:1
Slot Width Requirements	0.45-4.0mm	<0.45mm: Not standard (custom tooling required) >4.0mm: Must use routing process
Minimum Spacing Specifications	2.8MIL(0.07mm)	Mass Production:3.0 mil(0.076mm) Prototype Production:2.8 mil(0.07mm)
Trace Width Tolerance Specifications	+/10%-20%	Impedance-controlled Traces:+10% Standard Traces:+20% (default when no special requirements apply)
Copper Thickness Specifications	0.5-60z	Prototype Production:0.5-6 oz Mass Production: 0.5-5 oz
Solder Mask Specifications	Brands: Guangxin(GWT)，Taiyo，Rongda	Color Selection: Red, Yellow, Blue, Green, White, Black, Purple. Matte Green White Ink:Exclusively uses Taiyo ink (for optimal reflectivity) Matte Finish: Typically Guangxin or Rongda brands
Via Filling Standards	Micro-vias(<0.45mm)	According to the data, the through holes for double-sided Windows should not be blocked, those for single-sided Windows should be half-blocked, and those for double-sided Windows should be fully blocked
Resin Plugging Specifications	Blind vias Through holes Back-drilled holes	Board Thickness Range:0.1-80mmHole Diameter Tolerance: Standard holes: 0.1-1.0mm Back-drilled holes: 0.15-10mm Through holes: 40:1 Blind vias: 3:1 Max variation of plugged holes on same PCB: <0.2mm
Gold Finger Beveling Specifications	Bevel Depth Remaining Thickness	Bevel Angle:30-60 degrees (default 45° if unspecified) Remaining Thickness:Client-specified(default 0.5mm) Depth:Auto-calculated based on board thickness
Minimum Routing Specifications	0.8mm	Industry-standard smallest router bit diameter: 0.8mm
Minimum Half-hole Specifications	0.5mm	Our Capability:Minimum finished half-hole diameter: 0.5mm
Special Processes	SpecialTechniques	HDl buried/blind vias、Half-hole 、Metal-edged 、Resin-filled viaStep gold fingers 、Stepped mounting holes、High-frequency PCBsAluminum substrate 、Mixed-material high-frequency laminates
HDl Layer Count	1-4 Layers	Capable of manufacturing high-density interconnect (HDl) boards with blind vias upto 4 layers.

PCBA Capabilities

Process Specifications	Manufacturing Capabilities	Process Technology Overview
Regular Lead Time	3-7days	Regular Prototype 50pcs : Materials are prepared , 3 days Small-batch Production 20-500 pcs : Materials are prepared, 5 days Batch Production 2,500 pcs : Materials are prepared , 7 days
PCBA Solder Type	PCBA，THT
PCB Size	45-1200mm	Minimum Size: 45mm × 45mm; Lower Than this size, panels need to be combined Maximum Size: 450mm × 1200mm
Daily Capacity	4 million points/days	PCBA SMT: 4 million points /day Post-Insertion Soldering: 500,000 points/ day
Component Size	0.4mm*0.2mm	Passive Components: SMD imperial 01005 (0.4mm × 0.2mm), 0201 High-precision ICs BGA and others: X-ray inspection pitch as low as 0.25mm
Placement Accuracy(100FP)	0.0375mm
MOQ	1 pcs
PCB Material	FR-4, FPC, Rigid-Flex PCB, Aluminum Substrate
Components serivice	Procurement Services	Full Procurement of Components Partial Procurement of Components No Procurement